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| TELEFUNKEN Semiconductors TDA 4173 TV Vertical Deflection Output Amplifier Technology: Bipolar Features D Output peak current, I5 = 2.5 A D Flyback current, peak to peak, I3 = 4 A D Thermal protection, Tj 140C Case: 7 leads special plastic case Block diagram + VS 2 6 3 Flyback generator 1 7 - + Power amplifier 5 Thermal protection 4 Deflection coil 94 8723 Figure 1 Block diagram Pin Configuration Pin 1 2 3 4 Function Inverted input Supply voltage Flyback generator Ground Pin 5 6 7 Function Output Output stage supply Non inverted input Rev. A1: 16.12.1994 1 TDA 4173 Absolute Maximum Ratings Parameters Supply voltage Flyback peak voltage Voltage at pin 3 Input voltage Output peak current: t = 2 ms, non repetitive f = 50/60 Hz, t < 10 ms f = 50/60 Hz, t > 10 ms DC current at pin 3, @ V5 < V2 Flyback current peak to peak, f= 50/60 Hz, tfly 1.5 ms Power dissipation, Tcase = 70C Storage temperature Junction temperature Pin 2 Pins 5 and 6 Pins 1 and 7 Pin 5 Symbol VS V5, 6 V3 V1, 7 IO TELEFUNKEN Semiconductors Value 40 70 VS VS 3 3.5 2.5 Unit V V V V A Pin 3 I3 I3 Ptot Tstg Tj 100 4 20 - 40 to + 150 - 40 to + 150 mA A W C C Thermal Resistance Parameters Junction case Symbol RthJC Maximum 3 Unit K/W Electrical Characteristics VS = 35 V, Tamb = 25C, (see test circuits) Parameters Quiescent current Test Conditions / Pin I3 = 0, IS = 0 Pin 2 I3 = 0, IS = 0 Pin 6 figure 2 V1=1 V Pin 1 figure 3 I3 = 20 mA Pin 3 figure 4 VS = 35 V, Rr=39 kW figure 5 Pin 5 I5=1.2 A Pin 5 I5=2.0 A figure 6 I5=-1.2 A Pin 5 I5=-2.0 A figure 7 Symbol I2 I6 -I1 V3-4 V5 V5-4 Min Typ 15 30 0.5 0.5 18 0.35 0.6 1 1.2 140 0.7 1.1 1.5 1.8 Max 20 45 1 1.1 Unit mA Input quiescent current Saturation voltage to GND (Pin 4) Output voltage Saturation voltage to GND (Pin 4) Saturation voltage to supply (Pin 6) Junction temperature for thermal shut down mA V V V V5-6 V C Tj 2 Rev. A1: 16.12.1994 TELEFUNKEN Semiconductors TDA 4173 +V S 2 6 1 I1 4 94 8725 94 8724 I2 2 6 I6 5 +V S 10 kW 1 7 V7 Figure 2 4 1V Figure 3 94 8726 94 8727 2 1 6 3 I3 +VS 1 12 kW 2 6 5 +V S 3V 4 Figure 4 V3-4 4 2V Rr V5 5.6 k W Figure 5 94 8728 94 8729 2 1 6 5 I5 +VS 2 1 6 5 +VS V5-6 3V 4 Figure 6 V5-4 1V 4 Figure 7 I5 Rev. A1: 16.12.1994 3 TDA 4173 10 TELEFUNKEN Semiconductors 234 5 6 IC ( A ) 1 1 7 0.1 0 94 9071 100 VCE ( V ) Typical SOAR curves IC = I5, VCE = V5 and IC = -I5, VCE = V6 - V5 Curve no. 1 2 3 4 5 6 7 tp DC 10 ms 10 ms 1 ms 1 ms 1 ms 0.2 ms tp : T 1:2 1:4 1:2 1:4 1 : 20 1 : 10 tp T 94 9248 4 Rev. A1: 16.12.1994 TELEFUNKEN Semiconductors TDA 4173 Dimensions in mm Package: 7 leads special plastic case We reserve the right to make changes without further notice to improve technical design. Parameters can vary in different applications. All operating parameters must be validated for each customer application by customer. Should Buyer use TEMIC products for any unintended or unauthorized application, Buyer shall indemnify TEMIC against all claims, costs, damages, and expenses, arising out of, directly or indirectly, any claim of personal damage, injury or death associated with such unintended or unauthorized use. TEMIC TELEFUNKEN microelectronic GmbH, P.O.B. 3535, D-74025 Heilbronn, Germany Telephone: 49 (0)7131 67 2831, Fax Number: 49 (0)7131 67 2423 Rev. A1: 16.12.1994 5 TDA 4173 TELEFUNKEN Semiconductors OZONE DEPLETING SUBSTANCES POLICY STATEMENT It is the policy of TEMIC TELEFUNKEN microelectronic GmbH to 1. Meet all present and future national and international statutory requirements and 2. Regularly and continuously improve the performance of our products, processes, distribution and operating systems with respect to their impact on the health and safety of our employees and the public, as well as their impact on the environment. Of particular concern is the control or elimination of releases into the atmosphere of these substances which are known as ozone depleting substances ( ODSs). The Montreal Protocol ( 1987) and its London Amendments ( 1990) will severely restrict the use of ODSs and forbid their use within the next ten years. Various national and international initiatives are pressing for an earlier ban on these substances. TEMIC TELEFUNKEN microelectronic GmbH semiconductor division has been able to use its policy of continuous improvements to eliminate the use of any ODSs listed in the following documents that all refer to the same substances: (1) Annex A, B and list of transitional substances of the Montreal Protocol and the London Amendments respectively Class I and II ozone depleting substances in the Clean Air Act Amendments of 1990 by the Environmental Protection Agency ( EPA) in the USA and Council Decision 88/540/EEC and 91/690/EEC Annex A, B and C ( transitional substances ) respectively. (2) (3) TEMIC can certify that our semiconductors are not manufactured with and do not contain ozone depleting substances. 6 Rev. A1: 16.12.1994 |
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